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 BSM 25 GAL 120 DN2
IGBT Power Module
* Single switch with chopper diode * Including fast free-wheeling diodes * Package with insulated metal base plate
Type BSM 25 GAL 120 DN2 Maximum Ratings Parameter Collector-emitter voltage Collector-gate voltage
VCE
IC
Package
Ordering Code
1200V 38A
HALF BRIDGE GAL 1 C67076-A2009-A70
Symbol
Values 1200 1200
Unit V
VCE VCGR VGE IC
RGE = 20 k
Gate-emitter voltage DC collector current
20 A 38 25
TC = 25 C TC = 80 C
Pulsed collector current, tp = 1 ms
ICpuls
76 50
TC = 25 C TC = 80 C
Power dissipation per IGBT
Ptot
200
W + 150 -55 ... + 150 0.6 1 0.8 2500 20 11 F 55 / 150 / 56 Vac mm K/W C
TC = 25 C
Chip temperature Storage temperature Thermal resistance, chip case Diode thermal resistance, chip case Diode thermal resistance, chip-case,chopper Insulation test voltage, t = 1min. Creepage distance Clearance DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1
Tj Tstg RthJC RthJCD RTHJCDC Vis
-
Semiconductor Group
1
Mar-29-1996
BSM 25 GAL 120 DN2
Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Symbol min. Static Characteristics Gate threshold voltage Values typ. max. Unit
VGE(th)
4.5 5.5 2.5 3.1 0.5 2 6.5 3 3.7
V
VGE = VCE, IC = 1 mA
Collector-emitter saturation voltage
VCE(sat)
-
VGE = 15 V, IC = 25 A, Tj = 25 C VGE = 15 V, IC = 25 A, Tj = 125 C
Zero gate voltage collector current
ICES
0.8 -
mA
VCE = 1200 V, VGE = 0 V, Tj = 25 C VCE = 1200 V, VGE = 0 V, Tj = 125 C
Gate-emitter leakage current
IGES
180
nA
VGE = 20 V, VCE = 0 V
AC Characteristics Transconductance
gfs
10 1.65 0.25 0.11 -
S nF -
VCE = 20 V, IC = 25 A
Input capacitance
Ciss Coss
-
VCE = 25 V, VGE = 0 V, f = 1 MHz
Output capacitance
VCE = 25 V, VGE = 0 V, f = 1 MHz
Reverse transfer capacitance
Crss
-
VCE = 25 V, VGE = 0 V, f = 1 MHz
Semiconductor Group
2
Mar-29-1996
BSM 25 GAL 120 DN2
Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Symbol min. Switching Characteristics, Inductive Load at Tj = 125 C Turn-on delay time Values typ. max. Unit
td(on)
75 150
ns
VCC = 600 V, VGE = 15 V, IC = 25 A RGon = 47
Rise time
tr
65 130
VCC = 600 V, VGE = 15 V, IC = 25 A RGon = 47
Turn-off delay time
td(off)
420 600
VCC = 600 V, VGE = -15 V, IC = 25 A RGoff = 47
Fall time
tf
50 75
VCC = 600 V, VGE = -15 V, IC = 25 A RGoff = 47
Free-Wheel Diode Diode forward voltage
VF
2.3 1.8 2.8 -
V
IF = 25 A, VGE = 0 V, Tj = 25 C IF = 25 A, VGE = 0 V, Tj = 125 C
Reverse recovery time
trr
0.13 -
s
IF = 25 A, VR = -600 V, VGE = 0 V diF/dt = -800 A/s, Tj = 125 C
Reverse recovery charge
Qrr
C
IF = 25 A, VR = -600 V, VGE = 0 V diF/dt = -800 A/s Tj = 25 C Tj = 125 C
2.3 6 -
Semiconductor Group
3
Mar-29-1996
BSM 25 GAL 120 DN2
Electrical Characteristics, at Tj = 25 C, unless otherwise specified Parameter Symbol min. Values typ. max. Unit
Chopper Diode Chopper diode forward voltage
VFC
2.3 1.8 2.8 -
V
IFC = 35 A, VGE = 0 V, Tj = 25 C IFC = 35 A, VGE = 0 V, Tj = 125 C
Reverse recovery time, chopper
trrC
250 -
ns
IFC = 35 A, VR = -600 V, VGE = 0 V diF/dt = -800 A/s, Tj = 125 C
Reverse recovery charge, chopper
QrrC
C
IFC = 35 A, VR = -600 V, VGE = 0 V diF/dt = -800 A/s Tj = 25 C Tj = 125 C
2 5 -
Semiconductor Group
4
Mar-29-1996
BSM 25 GAL 120 DN2
Circuit Diagram
Package Outlines Dimensions in mm Weight: 190 g


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